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JP-P600 : Pad Thermal
JP-P600 series is a gap filled with high-performance thermal conductivity material, mainly used in electronic devices and heat sinks or product transfer interface between the enclosure. JP-P600 series has a good adhesive, flexible, good compression performance and excellent thermal conductivity. So that it can be fully in use of electronic originals and the air discharge between the heat sink in order to achieve access to the full. Heat effect increased significantly. JP-P600 Series also has a certain degree of self-adhesive, compared to ordinary thermal insulation material in the product installation process has brought great convenience, easy off, easy to operate.
Feature:
1.Good thermal conductivity
2.Ultra soft and high compressibility
3.Natural tack
4.Easy to assembly
5.Very good insulator
Application:
Electronic components:IC、CPU、MOS
LED、M/B、P/S、HEAT SINK、LCD-TV、N/B PC、PC、Telecom Device、Wireless Hub etc.
DDR II Module、DVD Applications、Hand-set applications etc.
Dimension:200mm*400mm,300mm*300mm
Thickness :0.3mm-13mm -
JP-P250 : Thermal Conductive Pads
JP-P250 series is a gap filled with high-performance thermal conductivity material, mainly used in electronic devices and heat sinks or product transfer interface between the enclosure. JP-P250 series has a good adhesive, flexible, good compression performance and excellent thermal conductivity. So that it can be fully in use of electronic originals and the air discharge between the heat sink in order to achieve access to the full. Heat effect increased significantly. JP-P250 Series also has a certain degree of self-adhesive, compared to ordinary thermal insulation material in the product installation process has brought great convenience, easy off, easy to operate.
Feature:
1.Good thermal conductivity
2.Ultra soft and high compressibility
3.Natural tack
4.Easy to assembly
5.Very good insulator
Application:
Electronic components:IC、CPU、MOS
LED、M/B、P/S、HEAT SINK、LCD-TV、N/B PC、PC、Telecom Device、Wireless Hub etc.
DDR II Module、DVD Applications、Hand-set applications etc.Dimension:200mm*400mm,300mm*300mm
Thickness :0.3mm-13mm
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JP-P1000 : Thermal Conductivity Graphite
Feature:
1. Ultra high thermal conductivity
2. Easy to assembly
3. Pre-Cut for different shape
Electronic components:
IC, CPU, MOS
LED, M/B, P/S, HEAT SINK, LCD-TV, N/B PC, PC, Telecom Device, Wireless Hub etc.
DDR II Module, DVD Applications, Hand-set applications etc.
Conductivity:
Our expertise has enable us to ensure finest
We are engaged in offering wide range of Thermal Pad that is procured from our trusted and reliable vendors. The pads are designed to be clean, grease free and flexible. It minimizes the thermal resistance from the case of a power semiconductor to the heat sink. T-pads electrically isolate the semiconductor from the heat sink and have sufficient dielectric strength to withstand high voltage. They are also tough to resist puncture by the facing metal surface. These products are available with different configurations and features as per the requirement of the client. Our products are also known for their excellent quality, prompt service and reasonable price. With a strong support from our rich vendor base, we are capable of offering an exclusive range of Thermal Pad. The use of high quality raw material in manufacturing helps us to maintain a high level of safety in a long term and keep us ahead in the competitive market. It is developed in tandem with the international quality standards. Our range of product passes through high quality test conducted by our quality experts to ensure that no faulty product reaches the clients. Backed by the most advanced & sophisticated machining facilities and a proficient work team, we are able to meet the varied requirements of our clients.
Thermal Pad
by subjecting our products to stringent quality control measures during each stage of production and while dispatch. We sincerely welcome all relevant friends all over the world to come for visit and cooperation!We are engaged in offering wide range of Thermal Pad that is procured from our trusted and reliable vendors. The pads are designed to be clean, grease free and flexible. It minimizes the thermal resistance from the case of a power semiconductor to the heat sink. T-pads electrically isolate the semiconductor from the heat sink and have sufficient dielectric strength to withstand high voltage. They are also tough to resist puncture by the facing metal surface. These products are available with different configurations and features as per the requirement of the client. Our products are also known for their excellent quality, prompt service and reasonable price. With a strong support from our rich vendor base, we are capable of offering an exclusive range of Thermal Pad. The use of high quality raw material in manufacturing helps us to maintain a high level of safety in a long term and keep us ahead in the competitive market. It is developed in tandem with the international quality standards. Our range of product passes through high quality test conducted by our quality experts to ensure that no faulty product reaches the clients. Backed by the most advanced & sophisticated machining facilities and a proficient work team, we are able to meet the varied requirements of our clients.
