Thermal Pastes

JUNPUS INTERNATIONAL
JunPus International Co., Ltd. specializes in Manufacture, Supply and Export Thermal Pastes, with a factory in Taiwan. It has always been our focus to manufacture finest products and to deliver them on time with attentive after-sales service. Our innovative spirit enables us to stay a step ahead of our competitors by providing the widest range products. Enquiries from global wholesalers, Distributors, buyers, agents and OEM/ODM are welcome.
JunPus International Co., Ltd.
Tel: +886-2-25539932
Fax: +886-2-25533858
Address: 4F., No.101, NINHSIA RD. DATONG DISTRICT, Taipei, Taiwan
You are here: Home -> Products -> Thermal Pastes
  • Thermal Compounds - JP-D8000 JP-D8000 : Thermal Compounds
    JP-D8000 Made with high-purity thermal conducting materials, JP-D8000 exhibits excellent thermal conduction thanks to its finer molecular structure produced by nanoscale treatment. This product has the following superior properties such as high chemical stability, being non-corrosive, anti-oxidation, non-toxicity, non-volatility, non-flammability, and causing no irritation to human skin. It can withstand long-term storage, does not easily solidify, and can be readily implemented to the printing and coating process.

    JP-D8000 Thermally conductive compounds are grease-like products which is formulated with Nano diamond powder and silicone fluids as base oil to provide superior thermal conductivity.
    Good performance is obtained when use JP-D8000 for thermal conductivity of semiconductor devices, such as CPUs, ICs, High Power LED and power transistors.

    Application:

    Main ingredients:Nanodiamond, silicon
    • Thermal Conductivity:4.5 (W/m•K)
    • Major applications:
    o Heat sink interface for High Bright LED High Bright LED
    o Heat sink interface for CPU in various computers or high-power chips
    o Heat sink interface for Graphics Processing Unit (GPU) in different display cards
    o Heat sink interface for the high-power chips in power source electronics such as power supply
    • This product complies with the RoHS (Restriction of use of hazardous substances) Directive: SGS no.CE/2008/12124

    Product Features:
    • Superior thermal conduction and low thermal resistivity.
    • Easy to work with, non-caustic, anti-oxidation, not easily solidifying.
    • Wide range of applicable temperatures and stable thermal conductivity.
    Better Rcontact : advantage II


    Coralloid shape
    worse mobility and voids forming

    Summary of Diamond Characters

    Color Appearance: Gray paste
    Viscosity: 38,000 CPS
    Specific Gravity : 2.0 g/cm3
    Thermal Conductivity: 4.5 w/m-K
    Volume Resistivity: 3.8x1013 ohm-cm
    Dielectric Constant: 14.5 at 1MHz
    Volatile matter: 0.22% 120oC @96hrs
    Out Gasing: 0.05%: -40oC,10hrs/ 90oC,10hrs  × 7 cycles
    Temperature Stability: -50oC to 250oC
    Shelf Life: 5 years
  • Thermal Greases - JP-D9000 JP-D9000 : Thermal Greases
    JP-D9000 Made with high-purity thermal conducting materials, JP-D9000 exhibits excellent thermal conduction thanks to its finer molecular structure produced by nanoscale treatment. This product has the following superior properties such as high chemical stability, being non-corrosive, anti-oxidation, non-toxicity, non-volatility, non-flammability, and causing no irritation to human skin. It can withstand long-term storage, does not easily solidify, and can be readily implemented to the printing and coating process.

    JP-D9000 Thermally conductive compounds are grease-like products which is formulated with Nano diamond powder and silicone fluids as base oil to provide superior thermal conductivity.
    Good performance is obtained when use N-302 for thermal conductivity of semiconductor devices, such as CPUs, ICs, High Power LED and power transistors.

    Application:
    Main ingredients:Nanodiamond, silicon
    •Thermal Conductivity:7.7 (W/m•K)
    •Major applications:
    oHeat sink interface for High Bright LED High Bright LED
    oHeat sink interface for CPU in various computers or high-power chips
    oHeat sink interface for Graphics Processing Unit (GPU) in different display cards
    oHeat sink interface for the high-power chips in power source electronics such as power supply
    •This product complies with the RoHS (Restriction of use of hazardous substances) Directive: SGS no.CE/2008/12124

    Product Features:
    •Superior thermal conduction and low thermal resistivity.
    •Easy to work with, non-caustic, anti-oxidation, not easily solidifying.
    •Wide range of applicable temperatures and stable thermal conductivity.
    Better Rcontact : advantage II



    Coralloid shape
    worse mobility and voids forming

    Summary of Diamond Characters

    Color Appearance: Gray paste
    Viscosity: 89,000 CPS
    Specific Gravity : 2.8 g/cm3
    Thermal Conductivity: 7.7 w/m-K
    Volume Resistivity: 3.8x1013 ohm-cm
    Dielectric Constant: 14.5 at 1MHz
    Volatile matter: 0.21% 120oC @96hrs
    Out Gasing: 0.04%: -40oC,10hrs/ 90oC,10hrs  × 7 cycles
    Temperature Stability: -50oC to 250oC
    Shelf Life: 5 years
  • CPU Paste - JP-NS200 JP-NS200 : CPU Paste
    JP-NS200 are formulated with Synthetic fluids and highly conductive ceramic fillers. These finely engineered compounds provide low bleed and solve the problems of contamination and migration associated with silicone based products. They offer better stability for a longer life cycle with high thermal conductivity (2 W/m°K) and low thermal resistance (0.014 °C-in2/W).

    Product Specifications  
    Usage and Notes:
    1.If there is the use of oil separation, and it is the torsion normal variability of the phenomenon of thermal paste, stir only after the return to normal use.
    2.For CPU, graphics card ... and so need a quick cooling of electronic components.
    3.Avoid dust or impurities attached to the thermal paste, which leads to increased thermal resistance and reduce heat dissipation.
    4.After use, cover the container should be placed in the refrigerator and back to it.
    5.After the factory thermal paste, as far as 6 months after use.

    Storage and management practices:
    1.Preserve the environment: temperature refrigeration, the temperature range +5 ℃ ~ +25 ℃.
    2.Keep away from heat sources and combustible fire.
    3.Do not place in the dust clouds of the air environment.
    4.When not in use, keep the container in a closed case.
    5.Handling, please pay attention not to destroy, to break the container.

    Security:
    1.Avoid contact with eyes and non-food.
    2.Avoid prolonged contact with skin.

Our secret of success has been our management's policy of adhering to business ethics in its dealing with customers. We assure you of on-time delivery of finest

Thermal Pastes

backed by prompted and careful after-sales service.

We specialize in offering a variety of Thermal Pastes which is manufactured using quality raw material which make our products long lasting. It is usually an overlooked, but essential component of any modern computer system. Although it has been used since the inception of devices that output heat, the demand for high-efficiency thermal compound for CPU cooling is a recent development. With the help of our distinguished professionals, we have been able to understand the specific requirements of our clients and accordingly necessary services. Moreover, we offer the products at highly competitive prices and ensure that they are delivered within the stipulated time. We are engaged in offering a wide range of Thermal Pastes are manufactured using state-of-the-art technology and latest machinery. The raw material we use is procured from some of the most renowned and reliable vendors and is stringently tested for quality before being used in the production process. We are able to supply you with products of absolute top quality in terms of both their dimensional accuracy and their exceptional resistance to wear. These features are further guaranteed by the fact that we also apply the latest advances in modern production methods and equipment. Our clients also can avail these products packed in superior packaging material.

Language:

German, Deutsch English Spanish, Español French, Français Hindi, हिन्दी Itanlian, Italiano Dutch, Nederlandse Portugese, Português Russian, Русский