JunPus thermal compounds deliver advanced heat dissipation solutions tailored for high-performance AI chips, CPUs, GPUs, and 5G base stations.
Engineered for cutting-edge semiconductor technologies,
our patented thermal pastes optimize thermal conductivity, ensuring stable performance under intensive workloads. Trusted across electronics, data centers, and telecommunications
JunPus International Partners with AINEX to Revolutionize Thermal Management in Japan with the Launch of JP-DX1 Diamond Thermal Paste
（Taiwan ,2015）JunPus International Co., Ltd., a global innovator in advanced thermal interface materials, is pleased to announce a strategic collaboration with AINEX, a leading Japanese company specializing in PC accessories and cooling solutions. Together, they proudly introduce the JP-DX1 Diamond Thermal Paste, a groundbreaking product engineered for high-performance thermal management, to the Japanese market.
This partnership leverages JunPus’s cutting-edge nanotechnology, combined with AINEX’s market expertise, to address the growing demand for highly efficient, durable, and safe thermal solutions in both consumer and industrial sectors. The JP-DX1 is a testament to JunPus’s commitment to delivering world-class thermal materials tailored to the most demanding applications.
Page 2 of 2
Server Cooling Solutions
High-Performance Thermal Materials
Thermal Paste Expert
Thermal Interface Material
High Thermal Conductivity
Cooling Solutions
Performance Starts with Superior Thermal Connectivity.For OEM/ODM products please go to JunPus International Co., Ltd.
Do you need assistance?
For any questions or concerns, you can reach us via our contact form
