JunPus thermal compounds deliver advanced heat dissipation solutions tailored for high-performance AI chips, CPUs, GPUs, and 5G base stations.
Engineered for cutting-edge semiconductor technologies,
our patented thermal pastes optimize thermal conductivity, ensuring stable performance under intensive workloads. Trusted across electronics, data centers, and telecommunications
In today’s world of increasingly efficient and precise electronics, thermal management is critical for ensuring product performance and longevity. As a professional brand in thermal management, JunPus offers high-quality thermal paste products and application solutions, widely used in electronics, LEDs, automotive, and industrial sectors, delivering reliable support for modern thermal management needs.
Why Choose JunPus?
1. High-Performance Thermal Pastes
JunPus’ thermal paste product line, such as JP-DX2 and JP-DXSquare Elite, is made with advanced materials, offering:
• Exceptional Thermal Conductivity: With a thermal conductivity of up to 18.3 W/m-K, it effectively enhances heat dissipation.
• Stability and Durability: Operates in extreme temperature ranges (-50°C to 200°C) without decomposition or leakage.
• Eco-Friendly Properties: Complies with RoHS and REACH international environmental standards.
2. Versatile Application Techniques
JunPus provides comprehensive application solutions tailored for various industries and use cases, from manual small-batch application to large-scale automated production. Popular application methods include:
• Dot, Line, and Spiral Methods: Ideal for small electronic components, suitable for both manual and automated dispensing.
• Screen Printing and Stencil Printing: Perfect for precise application on PCBs and LED assemblies.
• Spray Coating and Transfer Printing: Designed for large areas or components with complex shapes.
3. Automation-Friendly Solutions
To meet Industry 4.0 demands, JunPus’ thermal pastes are compatible with various automated systems, including screw valve systems, 3-axis or 6-axis robotic arms, and screen printing machines, ensuring production efficiency and consistent application quality.
Applications
1. Thermal Management in Electronics
• Apply JunPus thermal paste on CPUs, GPUs, and other high-power electronic components to fill uneven surfaces and ensure efficient heat transfer to heatsinks.
• Ideal for high-performance servers, gaming devices, and digital products.
2. LED Manufacturing
• Coat thermal paste between LED chips and heat sinks to improve light efficiency and extend the lifespan of LED lamps.
• Screen printing is particularly effective for batch LED encapsulation, ensuring uniform coverage and stable performance.
3. Automotive Electronics and New Energy
• Use JunPus thermal paste in electric vehicle battery modules and electronic control units (ECUs) for effective heat dissipation and enhanced system stability.
• Withstands harsh conditions in automotive applications, including high temperatures, pressures, and vibrations.
4. Industrial Equipment and Power Modules
• Apply thermal paste to high-power motors and power modules to enhance thermal transfer efficiency and prolong equipment lifespan.
JunPus Comprehensive Solutions
Product Selection
JunPus offers a full range of products, from high-performance thermal pastes to specialized cartridges, such as:
• PE Silicone Sealant Cartridge: Made from premium polyethylene, with a capacity of 300ml to 310ml, suitable for precise application of high-viscosity thermal pastes.
• Customizable Nozzle Designs: Accommodates different component shapes and application needs.
Technical Support
JunPus provides end-to-end technical assistance, including:
• Recommendations for application parameters such as pressure, speed, and thickness control.
• Guidance on selecting and integrating automated equipment to enhance production efficiency.
Eco-Friendly and Sustainable
JunPus is committed to environmentally friendly practices. All thermal pastes and application systems comply with international environmental standards, supporting green production initiatives.
Thermal Paste Application Methods: Comprehensive Overview
Below is a detailed summary of common thermal paste application methods in industrial production, along with their advantages, suitable scenarios, and associated equipment.
| Method | Principle | Advantages | Suitable Scenarios | Equipment/Tools |
|---|---|---|---|---|
| Dot Method | Apply thermal paste at the center point and allow it to spread naturally under pressure. | Simple and quick, ideal for small components. | Small electronic components such as CPUs, GPUs, IC modules. | Manual dispensers, automated dispensing machines. |
| Line Method |
Apply a straight line of thermal paste and let it spread when pressed. |
Even coverage, suitable for rectangular components. | Long electronic modules, LED heat structures. | Automated dispensing machines. |
| Cross Method | Apply two intersecting lines in an “X” shape. | Broader coverage, ideal for larger components. | Large heatsinks, IC structures. | Manual dispensers, automated dispensing machines. |
| Spiral Method | Apply thermal paste in a spiral pattern from the center to the edges. | Uniform coverage, though slightly complex. | Large heatsink structures. | Automated dispensing equipment. |
| Spread Method | Use a spatula to evenly spread thermal paste across the surface. | Suitable for flat surfaces, ensures even coating. | Flat heatsinks, module substrates. | Spatulas, automated spreading tools. |
| Screen Printing | Transfer thermal paste through a mesh stencil onto the substrate. | High precision, ideal for batch production. | LED encapsulation, flat PCBs. | Screen printing machines, spatulas. |
| Spray Coating | Atomize thermal paste using a spray gun for uniform application. | Suitable for large or irregular surfaces. | LED encapsulation, large heatsinks. | Spray coating equipment. |
| Transfer Printing | Use a transfer medium to apply thermal paste to the target surface. | Ideal for detailed patterns. | Precision components, electronic modules. | Transfer printing systems. |
| Stencil Printing | Use a stencil to define the application area for thermal paste. | High-resolution application, controllable thickness. | SMT PCBs, precision electronics. | Stencil printing equipment. |
Conclusion
As a professional provider of thermal management solutions, JunPus excels not only in developing high-performance thermal pastes but also in offering versatile application methods to meet the dual demands of heat dissipation and production efficiency across industries.
To learn more about JunPus’ thermal paste products and application technologies, visit JunPus Official Website or contact our technical support team today!
Performance Starts with Superior Thermal Connectivity.For OEM/ODM products please go to JunPus International Co., Ltd.
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