JunPus

JunPus thermal compounds deliver advanced heat dissipation solutions tailored for high-performance AI chips, CPUs, GPUs, and 5G base stations.

Engineered for cutting-edge semiconductor technologies,

our patented thermal pastes optimize thermal conductivity, ensuring stable performance under intensive workloads. Trusted across electronics, data centers, and telecommunications

CONTACT US

At JunPus, we value every connection and are dedicated to providing you with the best support. Whether you’re seeking product information, exploring business partnerships, or have general inquiries, our team is here to assist you. Reach out to us using the appropriate contact method below.

📍 Address

4F., No. 101, Ningsia Rd.,

Datong District, Taipei City 10358,

Taiwan (R.O.C.)

📞 Phone

+886-2-2553-9932

✉️ Email

Thermal@JunPus.com

Submit a Product Review

We invite reviewers, bloggers, and content creators to share their insights on our cutting-edge thermal solutions. Use the link below to submit your review and become a part of the JunPus story:

Review Form

Marketing Cooperation

Interested in collaborating with JunPus on marketing campaigns or partnerships? Let’s work together to create impactful campaigns. Fill out the form using the link below:

Marketing Cooperation Form

To: JunPus International Co., Ltd.

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Our dedication and expertise have enabled us to meet and exceed international standards in the quality of our thermal paste. We are committed to delivering exceptional solutions tailored to diverse manufacturing requirements and unmatched service to our clients. http://www.JunPus.com/

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JunPus

Performance Starts with Superior Thermal Connectivity.For OEM/ODM products please go to JunPus International Co., Ltd.

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