Compact AI workstations make thermal-interface engineering a system-level question. The NVIDIA GB10 Grace Blackwell Superchip used in DGX Spark combines CPU and GPU capabilities. MediaTek confirmed its co-design role in October 2025. NVIDIA's hardware guide, updated on 21 October 2026, lists a 20-core Arm CPU, 128 GB of unified memory and a 150 × 150 × 50.5 mm system enclosure. [1][2]

For OEM engineers and thermal-solution teams, the opportunity is not simply to specify a higher conductivity number. It is to qualify the assembled heat path: the component surface, thermal interface material, cooling surface and mechanical mounting conditions. Research on contact pressure, material application and durability helps turn those design requirements into a practical evaluation plan.