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Superintelligence, sometimes abbreviated as SI, describes the prospect of AI systems with capabilities far beyond human intelligence. OpenAI’s discussion of superalignment uses the term for substantially more capable future systems. This article does not assume that superintelligence has been achieved. For hardware teams, the practical issue is already here: operating increasingly demanding AI compute within a dependable thermal envelope.

For teams developing AI servers and accelerator assemblies, a thermal paste evaluation reaches beyond the material data sheet. In automated dispensing, the paste must be deposited in a controlled way and form the intended thermal interface after assembly. A useful trial connects three records: the machine setup, the individual deposit and the assembled joint.

September 12–18, 2026

As AI servers continue to move toward higher chip power, advanced packaging and direct-to-chip liquid cooling, thermal performance can no longer be evaluated by thermal conductivity alone.

This week, JunPus reviewed new technical and industry materials covering three important areas:

1. PFAS transparency and cooling-material supply chains
2. Cold-plate and coolant co-design for high heat flux
3. Transient thermal loads and reliability validation

The external data summarized below

Taipei, Taiwan — [05.20 , 2025]

JunPus International Co., Ltd., a global leader in thermal interface materials, is excited to announce the upcoming release of LiquidTherm Coolant, a next-generation coolant engineered for extreme performance and long-term system reliability.

As the demand for high-efficiency thermal management in AI computing, data centers, and high-performance gaming continues to rise, JunPus answers with a liquid

Taipei , Taiwan – January 8, 2025 —— As CES 2025 sets the stage for global tech innovations, JunPus reinforces its leadership in thermal management solutions with its flagship product, JP-DXSquare Elite Thermal Paste. Designed to address the increasing heat dissipation demands of AI processors, EV battery systems, high-performance GPUs, and servers, this advanced thermal paste is poised to be a

In today’s world of increasingly efficient and precise electronics, thermal management is critical for ensuring product performance and longevity. As a professional brand in thermal management, JunPus offers high-quality thermal paste products and application solutions, widely used in electronics, LEDs, automotive, and industrial sectors, delivering reliable support for modern thermal management needs.

EFD Tubes by JunPus: A Revolution in Precision Dispensing

Precision dispensing is a critical process in modern high-tech industries, including electronics, medical devices, LED manufacturing, and automotive components. To meet these demanding requirements, JunPus has developed the EFD Precision Dispensing Tubes, offering reliable and efficient solutions for a wide range of dispensing applications.

JunPus PE Silicone Sealant Cartridge: Tailored for Thermal Paste Applications

The JunPus PE Silicone Sealant Cartridge is engineered for the precision dispensing of high-performance thermal pastes, such as JP-DX2 and JP-DXSquare Elite. With its advanced PE (Polyethylene) material and ergonomic design, it ensures efficient thermal paste application across a range of industries, including electronics, LED lighting, automotive, and industrial

[ Taiwan, 2024] – JunPus International, a global leader in thermal management solutions, proudly announces the launch of JP-DXSquare Elite Nano Diamond Thermal Paste, a breakthrough in thermal interface material technology designed to meet the demands of high-performance computing, AI applications, and industrial cooling solutions.

[Japan, 2024] – Ainex, a leading brand in PC hardware solutions, in collaboration with JunPus International, proudly announces the official launch of JP-DX Elite Thermal Paste in 2024. This groundbreaking product sets a new benchmark in thermal management, delivering cutting-edge cooling performance for high-performance computing and next-generation AI systems.

Driving Innovation and Responsibility in the Thermal Management Industry

[Taiwan, 2023] – JunPus International, a global leader in thermal management solutions, is proud to announce its enhanced focus on Environmental, Social, and Governance (ESG) initiatives as part of its long-term commitment to sustainability and corporate responsibility.

Enhancing Thermal Management for High-Powered Devices

With the rapid evolution of technology, the demand for efficient thermal management in high-performance electronic devices is at an all-time high. In response, JunPus International proudly introduces the JP-DX2 Nano-Diamond Thermal Compound—a cutting-edge thermal interface material (TIM) designed to meet the challenges of modern electronics.

JunPus International Co., Ltd., a leader in advanced thermal interface materials, is thrilled to announce its collaboration with AINEX, a renowned Japanese provider of PC accessories and cooling solutions, to introduce the JP-DX2 Diamond Thermal Paste to the Japanese market. This partnership leverages JunPus’s cutting-edge technology and AINEX’s extensive distribution network to deliver unparalleled thermal management solutions to professionals and enthusiasts across Japan.

JunPus International Partners with AINEX to Revolutionize Thermal Management in Japan with the Launch of JP-DX1 Diamond Thermal Paste

（Taiwan ,2015）JunPus International Co., Ltd., a global innovator in advanced thermal interface materials, is pleased to announce a strategic collaboration with AINEX, a leading Japanese company specializing in PC accessories and cooling solutions. Together, they proudly introduce the JP-DX1 Diamond Thermal

JunPus International Co., Ltd. Launches JP-Dx1 for Superior Heat Dissipation

Taipei, Taiwan – JunPus International Co., Ltd., a global leader in thermal management solutions, proudly announces the release of JP-Dx1, a cutting-edge thermal compound engineered with advanced nano diamond technology. JP-Dx1 sets a new benchmark in heat dissipation, catering to the growing demands of high-performance CPUs, GPUs, and AI-driven processors.